RF-35 2-Layer PCB 0.3mm Thin Board with Immersion Silver for Microwave RF Applications
1.Introduction
The RF-35 PCB is a double-layer 0.3mm rigid circuit board featuring Taconic's organic-ceramic laminate technology. Designed for cost-effective microwave and RF solutions, this board offers excellent electrical performance with a dielectric constant of 3.5 and ultra-low 0.0018 dissipation factor. The immersion silver finish ensures superior conductivity while maintaining durability for demanding applications like power amplifiers and RF filters.
2.Features and Benefits
(1).Optimized RF Performance
Stable 3.5 dielectric constant at 1.9GHz
Ultra-low 0.0018 dissipation factor
41kV dielectric breakdown voltage
(2).Reliable Construction
Excellent peel strength for 0.5-1oz copper
UL-94 V0 flammability rating
Low moisture absorption
(3).Cost-Effective Solution
Designed for high-volume production
Suitable for rework-intensive applications
Enhanced surface smoothness
3.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | RF-35 (organic-ceramic laminate) |
| Layer Count | 2 layers |
| Board Dimensions | 71mm × 60mm (±0.15mm) |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.2mm |
| Via Type | Through-hole only |
| Finished Thickness | 0.3mm |
| Copper Weight | 1oz (outer layers) |
| Via Plating Thickness | 25μm |
| Surface Finish | Immersion Silver |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested |
4.PCB Stackup (2-Layer Rigid Structure)
Copper layer 1 - 35 μm
RF-35 Core - 10mil (0.254 mm)
Copper layer 2 - 35 μm
5.PCB Statistics:
Components: 10
Total Pads: 55
Thru Hole Pads: 41
Top SMT Pads: 14
Bottom SMT Pads: 0
Vias: 21
Nets: 2
6.Typical Applications
RF power amplifiers
Microwave filters
Signal couplers
Passive RF components
7.Quality Assurance
IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support